The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2008
Filed:
Jan. 22, 2007
David H. Danovitch, Granby, CA;
Mukta G. Farooq, Hopewell Junction, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
George R. Proto, Poughkeepsie, NY (US);
Da-yuan Shih, Poughkeepsie, NY (US);
David H. Danovitch, Granby, CA;
Mukta G. Farooq, Hopewell Junction, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
George R. Proto, Poughkeepsie, NY (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.