The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Jun. 24, 2009
Bing Dang, Chappaqua, NY (US);
David Hirsch Danovitch, Granby, CA;
Mario John Interrante, New Paltz, NY (US);
John Ulrich Knickerbocker, Monroe, NY (US);
Michael Jay Shapiro, Austin, NY (US);
Van Thanh Truong, Brossard, CA;
Bing Dang, Chappaqua, NY (US);
David Hirsch Danovitch, Granby, CA;
Mario John Interrante, New Paltz, NY (US);
John Ulrich Knickerbocker, Monroe, NY (US);
Michael Jay Shapiro, Austin, NY (US);
Van Thanh Truong, Brossard, CA;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for forming an integrated circuit assembly comprises forming first solder bumps on a first die, and forming a first structure comprising the first die, the first solder bumps, a first flux, and a first substratum. The first die is placed upon the first substratum. The first solder bumps are between the first die and the first substratum. The first flux holds the first die substantially flat and onto the first substratum.