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Mario John Interrante

This inventor holds 47 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignee: International Business Machines Corporation. Active years: 1987-2023.

USPTO Granted Patents = 47 (Patent Applications = 3)

% Patents Active = 70.2

Average Co-Inventor Count = 3.7

ph-index = 15

Forward Citations = 612(Granted Patents)

Location History:

Hopewell Junction, NY (US) (2015)
Armonk, NY (US) (2021)
New Paltz, NY (US) (1987 - 2023)

Company Filing History:

47 out of 166,159

International Business Machines Corporation

patents

Years Active: 1987-2023

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Areas of Expertise:

Silicon Interposer

3D Chip Stack

EMI Shielding

Lead-Free Alloys

Integrated Circuit Bonding

Optoelectronic Packaging

Conductive Adhesive

Electrical Connector

Ball Grid Arrays

Thermal Management

Mechanical Attachment

Interconnection Process

47 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11810893 - Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection (2023-11-07),

2. 11049841 - Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection (2021-06-29),

3. 10903187 - Selective area heating for 3D chip stack (2021-01-26),

4. 10262970 - Selective area heating for 3D chip stack (2019-04-16),

5. 9860996 - Selective area heating for 3D chip stack (2018-01-02),

6. 9431366 - Selective area heating for 3D chip stack (2016-08-30),

7. 9373590 - Integrated circuit bonding with interposer die (2016-06-21),

8. 9224712 - 3D bond and assembly process for severely bowed interposer die (2015-12-29),

9. 9105629 - Selective area heating for 3D chip stack (2015-08-11),

10. 9059241 - 3D assembly for interposer bow (2015-06-16),

11. 8689437 - Method for forming integrated circuit assembly (2014-04-08),

12. 8614512 - Solder ball contact susceptible to lower stress (2013-12-24),

13. 8487447 - Semiconductor structure having offset passivation to reduce electromigration (2013-07-16),

14. 8383505 - Solder ball contact susceptible to lower stress (2013-02-26),

15. 7781232 - Method to recover underfilled modules by selective removal of discrete components (2010-08-24),

Title: The Innovative Journey of Mario John Interrante

Introduction:

Mario John Interrante, a talented inventor hailing from New Paltz, NY, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents:

Mario John Interrante holds several patents in various technological domains, including advancements in renewable energy systems, smart home devices, and medical equipment.

Career Highlights:

With a career spanning over two decades, Mario John Interrante has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions to address them. His work has not only revolutionized industries but has also improved the quality of life for many individuals around the world.

Collaborations:

Throughout his career, Mario John Interrante has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion:

In conclusion, Mario John Interrante's passion for innovation and his dedication to pushing the boundaries of what is possible have solidified his position as a respected inventor in the technological landscape. His relentless pursuit of excellence continues to inspire the next generation of inventors to dream big and create a better future for all.

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