The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2013
Filed:
Sep. 14, 2012
Luc Guerin, Granby, CA;
Mario J. Interrante, New Paltz, NY (US);
Michael J. Shapiro, Austin, TX (US);
Thuy Tran-quinn, Katonah, NY (US);
Van T. Truong, Brossard, CA;
Luc Guerin, Granby, CA;
Mario J. Interrante, New Paltz, NY (US);
Michael J. Shapiro, Austin, TX (US);
Thuy Tran-Quinn, Katonah, NY (US);
Van T. Truong, Brossard, CA;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A solder ball contact and a method of making a solder ball contact includes: a first insulating layer with a via formed on an integrated circuit (IC) chip and a metal pad; an under bump metallurgy (UBM) structure disposed within the via and on a portion of the first insulating layer, surrounding the via; a second insulating layer formed on an upper surface of an outer portion of the UBM structure that is centered on the via; and a solder ball that fills the via and is disposed above an upper surface of an inner portion of the UBM structure that contacts the via, in which the UBM structure that underlies the solder ball is of a greater diameter than the solder ball.