The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Jan. 29, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Mario J. Interrante, Hopewell Junction, NY (US);
Katsuyuki Sakuma, Hopewell Junction, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B23K 31/02 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 2224/75502 (2013.01); H01L 2224/81948 (2013.01); H01L 2224/75301 (2013.01); H01L 21/563 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75743 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81211 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/8183 (2013.01); H01L 2224/81906 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/3511 (2013.01); H01L 2224/8191 (2013.01);
Abstract
A method for packaging a semiconductor device includes attaching a first array of solder material to a first surface of an interposer; bringing the first array of solder material into physical contact with a laminate; and initially bonding the interposer to the laminate by applying a first temperature and pressure gradient to the first array of solder material such that a melting temperature of the first array of solder material is not exceeded.