IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11810893 B1

PDFFull Text
Date of Patent:
Nov. 07, 2023

Filed:

May. 31, 2021

Silicon interposer sandwich structure for esd, emc, and emc shielding and protection

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

William Emmett Bernier, Endwell, NY (US);

Bing Dang, Chappaqua, NY (US);

John Knickerbocker, Monroe, NY (US);

Son Kim Tran, Endwell, NY (US);

Mario J. Interrante, New Paltz, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Daniel Morris;

Otterstedt & Kammer PLLC;

Primary Examiner:

Michelle Mandala

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 23/367 (2006.01); H01L 23/60 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 23/367 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/552 (2013.01); H01L 23/60 (2013.01); H01L 24/09 (2013.01); H01L 25/0655 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/15738 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19105 (2013.01);
Abstract

An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

Find Patent Forward Citations

Loading…