The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2009
Filed:
Apr. 22, 2008
David Danovitch, Canton de Granby, CA;
Julien Sylvestre, Chambly, CA;
David Danovitch, Canton de Granby, CA;
Julien Sylvestre, Chambly, CA;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for reducing stress and warpage in flip chip packages comprising providing a flip chip package including an organic substrate, an integrated circuit chip, and a cap member, providing a temporary structure having a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of the integrated circuit chip, soldering a bottom side of the organic substrate to a top side of the temporary structure, bonding a bottom side of the integrated circuit chip to a top side of the organic substrate with controlled chip collapse columns, coupling the cap member to the top side of the organic substrate, applying force to the flip chip package in a first direction, and applying force to the temporary structure in a second direction opposite the first direction in order to shear the top side of the temporary structure from the bottom side of the organic substrate to remove the temporary structure from the flip chip package.