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For the Inventor, By the Inventor

Chambly, Canada

Julien Sylvestre

USPTO Granted Patents = 19 

Average Co-Inventor Count = 2.0

ph-index = 4

Forward Citations = 48(Granted Patents)


Location History:

  • Quebec, CA (2012)
  • Bromont, CA (2013)
  • Chambly, CA (2009 - 2018)
  • Sherbrooke, CA (2017 - 2019)

Company Filing History:

goldMedal18 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal1 out of 3 
 
Systemex-energies International Inc.
 patents

Years Active: 2009-2019

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19 patents (USPTO):
1. 10390460 - Apparatus and methods for cooling of an integrated circuit (2019-08-20),
2. 10134704 - Thermocompression for semiconductor chip assembly (2018-11-20),
3. 9761542 - Liquid metal flip chip devices (2017-09-12),
4. 9735125 - Thermocompression for semiconductor chip assembly (2017-08-15),
5. 9698072 - Low-stress dual underfill packaging (2017-07-04),
6. 9373559 - Low-stress dual underfill packaging (2016-06-21),
7. 9287230 - Thermocompression for semiconductor chip assembly (2016-03-15),
8. 8939346 - Methods and systems involving soldering (2015-01-27),
9. 8932909 - Thermocompression for semiconductor chip assembly (2015-01-13),
10. 8910853 - Additives for grain fragmentation in Pb-free Sn-based solder (2014-12-16),
11. 8796049 - Underfill adhesion measurements at a microscopic scale (2014-08-05),
12. 8493746 - Additives for grain fragmentation in Pb-free Sn-based solder (2013-07-23),
13. 8197612 - Optimization of metallurgical properties of a solder joint (2012-06-12),
14. 7538432 - Temporary structure to reduce stress and warpage in a flip chip organic package (2009-05-26),
15. 7512518 - Method for measuring thin layers in solid state devices (2009-03-31),

Title: Innovations by Julien Sylvestre: Pioneering Solutions in Integrated Circuit Cooling

Introduction

Julien Sylvestre, a notable inventor based in Chambly, CA, has made significant contributions to the field of thermal management in integrated circuits. With a remarkable portfolio of 19 patents, he continues to push the boundaries of innovation in semiconductor technology.

Latest Patents

Among Julien's most recent inventions is a patent related to "Apparatus and methods for cooling of an integrated circuit." This invention utilizes a vessel to hold a coolant in liquid form, allowing thermal coupling with the integrated circuit (IC) to effectively transfer heat. The system includes a controller that intelligently modulates the heat flux supplied by the IC, optimizing the cooling process. Another pivotal patent is the "Thermocompression for semiconductor chip assembly," which describes an innovative assembly process for semiconductor chips using solder bumps and underfill materials, enhancing reliability and performance.

Career Highlights

Julien has had a distinguished career, working with prominent companies such as IBM and Systemex-Energies International Inc. His experience in these organizations has been instrumental in his development of pioneering technologies and methods that address critical challenges within the semiconductor industry.

Collaborations

Throughout his career, Julien has collaborated with talented professionals, including coworkers Peter Jeffrey Brofman and Marie-Claude Paquet. These collaborations have fostered a creative environment, enhancing the innovation process and leading to groundbreaking advancements in electronics.

Conclusion

Julien Sylvestre's contributions to integrated circuit technology reflect his dedication to solving complex engineering problems through innovative solutions. With an impressive track record of patents and collaborations in prestigious companies, he is well-positioned to continue making significant impacts in the field of semiconductor advancements.

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