The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Feb. 12, 2010
Charles L. Arvin, Hopewell Junction, NY (US);
Alexandre Blander, Bromont, CA;
Peter J. Brofman, Hopewell Junction, NY (US);
Donald W. Henderson, Ithaca, NY (US);
Gareth G. Hougham, Yorktown Heights, NY (US);
Hsichang Liu, Hopewell Junction, NY (US);
Eric D. Perfecto, Hopewell Junction, NY (US);
Srinivasa S. N. Reddy, Hopewell Junction, NY (US);
Krystyna W. Semkow, Hopewell Junction, NY (US);
Kamalesh K. Srivastava, Wappingers Falls, NY (US);
Brian R. Sundlof, Verbank, NY (US);
Julien Sylvestre, Bromont, CA;
Renee L. Weisman, Poughkeepsie, NY (US);
Charles L. Arvin, Hopewell Junction, NY (US);
Alexandre Blander, Bromont, CA;
Peter J. Brofman, Hopewell Junction, NY (US);
Donald W. Henderson, Ithaca, NY (US);
Gareth G. Hougham, Yorktown Heights, NY (US);
Hsichang Liu, Hopewell Junction, NY (US);
Eric D. Perfecto, Hopewell Junction, NY (US);
Srinivasa S. N. Reddy, Hopewell Junction, NY (US);
Krystyna W. Semkow, Hopewell Junction, NY (US);
Kamalesh K. Srivastava, Wappingers Falls, NY (US);
Brian R. Sundlof, Verbank, NY (US);
Julien Sylvestre, Bromont, CA;
Renee L. Weisman, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.