Lagrangeville, NY, United States of America

Srinivasa S N Reddy

This inventor holds 19 USPTO granted patents, primarily in Ceramic Substrate Technology. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 2001-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Srinivasa S N Reddy. Retrieved from https://idiyas.com/inventor/srinivasa-s-n-reddy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 73.7

Average Co-Inventor Count = 4.7

ph-index = 6

Forward Citations = 123(Granted Patents)


Location History:

  • Hopewell Junction, NY (US) (2013)
  • Lagrangeville, NY (US) (2001 - 2016)

Company Filing History:


Years Active: 2001-2016

Loading Chart...
Areas of Expertise:
Electromigration
Lead-Free Solder
Intermetallic Diffusion
Point of Care Testing
Dielectric Laminate
CVD of Metals
Thin Film Capacitor
Multilayer Substrate
Surface Metallization
Copper-Based Paste
Low Temperature Sintering
Grain Fragmentation
19 patents (USPTO):Explore Patents

Title: **Srinivasa S N Reddy: A Pioneer in Lead-Free Solder Innovations**

Introduction

Srinivasa S N Reddy, based in Lagrangeville, NY, is a notable inventor with an impressive portfolio of 19 patents. His work primarily focuses on innovations in lead-free solder interconnect structures, addressing critical challenges in semiconductor manufacturing and assembly.

Latest Patents

Among his latest inventions, Srinivasa has developed several groundbreaking technologies. One of these patents, titled "Electromigration-resistant lead-free solder interconnect structures," presents a novel lead-free solder interconnect structure and innovative methods for its fabrication. This technology comprises a semiconductor substrate, a copper pedestal, a barrier layer, and a lead-free solder layer, significantly enhancing the reliability and performance of electronic devices.

Another significant innovation is the patent for "Additives for grain fragmentation in Pb-free Sn-based solder." This invention introduces inert nano-sized particles that can be integrated into solder balls, improving the mechanical properties of solder joints. By utilizing various materials such as metal oxides and metal nitrides, Srinivasa's approach effectively enhances solder performance, ensuring better durability and reliability.

Career Highlights

Srinivasa has made substantial contributions to the technology sector while working with renowned companies. Notably, he has been associated with IBM (International Business Machines Corporation) and Globalfoundries Inc., where he leveraged his expertise to develop cutting-edge solutions for the semiconductor industry. His innovative spirit and dedication have propelled him to the forefront of semiconductor technology.

Collaborations

In his career, Srinivasa has collaborated with esteemed professionals in the field, including Rao Venkateswara Vallabhaneni and John Ulrich Knickerbocker. These collaborations have fostered a dynamic exchange of ideas and have played a crucial role in advancing his research and the development of his innovative technologies.

Conclusion

Srinivasa S N Reddy stands out as a significant figure in the realm of lead-free solder innovations. His contributions, marked by numerous patents, reflect a deep commitment to enhancing the reliability and functionality of electronic devices. As technology continues to evolve, innovators like Srinivasa play a crucial role in shaping the future of semiconductor processes, ensuring a sustainable and efficient approach to electronic manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…