The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2002
Filed:
Jun. 06, 1995
Farid Youssif Aoude, Wappingers Falls, NY (US);
Lawrence Daniel David, Wappingers Falls, NY (US);
Renuka Shastri Divakaruni, Ridgefield, CT (US);
Shaji Farooq, Hopewell Junction, NY (US);
Lester Wynn Herron, Hopewell Junction, NY (US);
Hal Mitchell Lasky, Hyde Park, NY (US);
Anthony Mastreani, Hopewell Junction, NY (US);
Govindarajan Natarajan, Pleasant Valley, NY (US);
Srinivasa S. N. Reddy, LaGrangeville, NY (US);
Vivek Madan Sura, Hopewell Junction, NY (US);
Rao Venkateswara Vallabhaneni, Wappingers Falls, NY (US);
Donald Rene Wall, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.