Shaji Farooq

This inventor holds 41 USPTO granted patents, primarily in Chip Interconnection. Top assignee: International Business Machines Corporation. Active years: 1991-2006.

USPTO Granted Patents = 41

% Patents Active = 95.1

Average Co-Inventor Count = 6.3

ph-index = 19

Forward Citations = 824(Granted Patents)

Company Filing History:

41 out of 166,264

International Business Machines Corporation

patents

Years Active: 1991-2006

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Areas of Expertise:

Dielectric Interposer

Chip Soldering

Ball Grid Array

Thermal Paste

Copper-Based Paste

Multilayer Capacitor

Module Assembly

Conductive Vias

Ceramic Substrates

Interconnection Structure

Connector Array

Fatigue Life

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6984792 - Dielectric interposer for chip to substrate soldering (2006-01-10),

2. 6574859 - Interconnection process for module assembly and rework (2003-06-10),

3. 6559527 - Process for forming cone shaped solder for chip interconnection (2003-05-06),

4. 6528145 - Polymer and ceramic composite electronic substrates (2003-03-04),

5. 6461493 - Decoupling capacitor method and structure using metal based carrier (2002-10-08),

6. 6444496 - Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof (2002-09-03),

7. 6358439 - Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias (2002-03-19),

8. 6333563 - Electrical interconnection package and method thereof (2001-12-25),

9. 6300164 - Structure, materials, and methods for socketable ball grid (2001-10-09),

10. 6297559 - Structure, materials, and applications of ball grid array interconnections (2001-10-02),

11. 6283359 - Method for enhancing fatigue life of ball grid arrays (2001-09-04),

12. 6275381 - Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof (2001-08-14),

13. 6271111 - High density pluggable connector array and process thereof (2001-08-07),

14. 6235996 - Interconnection structure and process module assembly and rework (2001-05-22),

15. 6216324 - Method for a thin film multilayer capacitor (2001-04-17),

Title: The Innovative Journey of Inventor Shaji Farooq

Introduction: Shaji Farooq, a talented inventor based in Hopewell Junction, NY, has made significant contributions to the field of technology with his creative solutions and groundbreaking ideas.

Latest Patents: Shaji Farooq holds several patents in various technological domains, showcasing his versatility and ingenuity in inventing new solutions to complex problems.

Career Highlights: Throughout his career, Shaji Farooq has demonstrated a keen eye for innovation, leading to the development of cutting-edge technologies that have revolutionized the industry.

Collaborations: Shaji Farooq has collaborated with leading tech companies and research institutions, leveraging his expertise to drive forward collaborative projects and bring new inventions to life.

Conclusion: Shaji Farooq's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors, inspiring others to push the boundaries of what is possible in the realm of technology.

Profile summary based on public USPTO records.

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