The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
May. 01, 2003
Peter J. Brofman, Hopewell Junction, NY (US);
Shaji Farooq, Hopewell Junction, NY (US);
John U. Knickerbocker, Hopewell Junction, NY (US);
Scott I. Langenthal, Hyde Park, NY (US);
Sudipta K. Ray, Wappingers Falls, NY (US);
Kathleen A. Stalter, Hopewell Junction, NY (US);
Peter J. Brofman, Hopewell Junction, NY (US);
Shaji Farooq, Hopewell Junction, NY (US);
John U. Knickerbocker, Hopewell Junction, NY (US);
Scott I. Langenthal, Hyde Park, NY (US);
Sudipta K. Ray, Wappingers Falls, NY (US);
Kathleen A. Stalter, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A pre-thermal reflown dielectric interposer having a plurality of vias traversing through the interposer which correspond to the I/O pads on a chip and substrate. Cone shaped solder elements reside within the vias, whereby these solder elements are cone shaped prior to thermal reflow to permit a reduced force for allowing some non-planarity for joining the chip to the substrate. The interposer may comprise a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. The interposer may also have an adhesive or adhesive layers disposed on the linear surfaces thereof. The present pre-thermal reflown interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads, as well as preventing over compression of the solder joints by acting as a stand off.