Hyde Park, NY, United States of America

Scott Ira Langenthal


Average Co-Inventor Count = 6.3

ph-index = 9

Forward Citations = 232(Granted Patents)


Location History:

  • Pleasant Valley, NY (US) (2001 - 2003)
  • Hyde Park, NY (US) (2000 - 2006)

Company Filing History:


Years Active: 2000-2006

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12 patents (USPTO):

Title: Scott Ira Langenthal: Innovator in Dielectric Interposer Technology

Introduction

Scott Ira Langenthal is a prominent inventor based in Hyde Park, NY (US), known for his significant contributions to the field of electronic packaging. With a total of 12 patents to his name, Langenthal has made remarkable advancements in the technology of dielectric interposers, which play a crucial role in chip-to-substrate soldering.

Latest Patents

Langenthal's latest patents include innovative designs for dielectric interposers that enhance the reliability of electronic modules. One of his notable inventions is a pre-thermal reflown dielectric interposer featuring a plurality of vias that correspond to the I/O pads on a chip and substrate. This design incorporates cone-shaped solder elements within the vias, allowing for reduced force during the joining process, accommodating some non-planarity. The interposer can be made from various materials, including polyester film, glass, alumina, polyimide, and heat curable polymers. Another significant patent focuses on preventing short circuits in flip chip packaging by isolating solder joints and preventing over-compression through the use of a dielectric interposer.

Career Highlights

Scott Ira Langenthal has built a successful career at International Business Machines Corporation (IBM), where he has been instrumental in developing cutting-edge technologies in electronic packaging. His work has not only advanced the field but has also contributed to the overall efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Langenthal has collaborated with notable colleagues, including John Ulrich Knickerbocker and Richard Francis Indyk. These partnerships have fostered innovation and have led to the successful development of various technologies in the industry.

Conclusion

Scott Ira Langenthal's contributions to dielectric interposer technology have significantly impacted the field of electronic packaging. His innovative patents and collaborations with esteemed colleagues highlight his dedication to advancing technology and improving electronic device performance.

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