The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Feb. 10, 1999
Applicant:
Inventors:
Scott I. Langenthal, Hyde Park, NY (US);
Thomas E. Lombardi, Poughkeepsie, NY (US);
Richard Francis Indyk, Wappingers Falls, NY (US);
John Ulrich Knickerbocker, Hopewell Junction, NY (US);
Srinivasa S. N. Reddy, Lagrangeville, NY (US);
Richard A. Shelleman, Poughkeepsie, NY (US);
Rao V. Vallabhaneni, Wappingers Falls, NY (US);
Donald Rene Wall, Poughkeepsie, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 ;
U.S. Cl.
CPC ...
B32B 3/00 ;
Abstract
A cost-effective surface metallization structure of a TCA carrier is produced by using a high-grit conducting paste to fill TSM vias in the TSM of the TCA carrier. This concept can be applied to alumina substrates with refractory metal conductors or to LCGC substrates with more noble metal conductors.