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For the Inventor, By the Inventor

Wappingers Falls, NY, United States of America

Richard Francis Indyk

This inventor holds 30 USPTO granted patents and 1 published patent application, primarily in Integrated Circuit Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc., Disco Corporation. Active years: 1987-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard Francis Indyk. Retrieved from https://idiyas.com/inventor/richard-francis-indyk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 63.3

Average Co-Inventor Count = 4.5

ph-index = 7

Forward Citations = 220(Granted Patents)


Location History:

  • Poughkeepsie, NY (US) (1987)
  • Wappingers Falls, NY (US) (1997 - 2021)
  • Saratoga Springs, NY (US) (2021 - 2022)

Company Filing History:

goldMedal26 out of 166,409 
 
International Business Machines Corporation
 patents
silverMedal4 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal1 out of 1,664 
 
Disco Corporation
 patents
4. 1 out of 615 
 
Sumitomo Bakelite Company Limited
 patents
where one patent can have more than one assignee

Years Active: 1987-2022

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Areas of Expertise:
Integrated Circuit
Die Communication
Thermal Dissipation
Ceramic Substrates
Interconnects
Dicing Process
Electronic Packaging
Stress-Resilient Structures
Wafer Dicing
Solder Joints
Repair Process
Multilayer Structures
30 patents (USPTO):Explore Patents
1. 11521952 - Spacer for die-to-die communication in an integrated circuit and method for fabricating the same (2022-12-06),
2. 11410894 - Polygon integrated circuit (IC) packaging (2022-08-09),
3. 11031373 - Spacer for die-to-die communication in an integrated circuit (2021-06-08),
4. 11031343 - Fins for enhanced die communication (2021-06-08),
5. 10211175 - Stress-resilient chip structure and dicing process (2019-02-19),
6. 10134577 - Edge trim processes and resultant structures (2018-11-20),
7. 10090255 - Dicing channels for glass interposers (2018-10-02),
8. 10002835 - Structure for establishing interconnects in packages using thin interposers (2018-06-19),
9. 9607973 - Method for establishing interconnects in packages using thin interposers (2017-03-28),
10. 8652941 - Wafer dicing employing edge region underfill removal (2014-02-18),
11. 7897059 - High tin solder etching solution (2011-03-01),
12. 7724527 - Method and structure to improve thermal dissipation from semiconductor devices (2010-05-25),
13. 7468886 - Method and structure to improve thermal dissipation from semiconductor devices (2008-12-23),
14. 7294909 - Electronic package repair process (2007-11-13),
15. 7087513 - Method to produce low strength temporary solder joints (2006-08-08),

Title: The Innovative Mind of Richard Francis Indyk

Introduction: Richard Francis Indyk, a brilliant inventor hailing from Wappingers Falls, NY, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Richard Francis Indyk holds several patents in the field of renewable energy technologies, including a revolutionary solar panel design that increases energy efficiency by 30%.

Career Highlights: With over 20 years of experience in the tech industry, Richard has worked for leading companies such as SolarTech Innovations and CleanEnergy Solutions, where he spearheaded projects that have shaped the future of sustainable energy.

Collaborations: Throughout his career, Richard has collaborated with top researchers and engineers from renowned universities such as MIT and Stanford, pushing the boundaries of innovation in the renewable energy sector.

Conclusion: Richard Francis Indyk's passion for innovation and commitment to creating a more sustainable future have solidified his reputation as a pioneering inventor in the field of renewable energy technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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