The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
May. 17, 2012
Richard F. Indyk, Wappingers Falls, NY (US);
Jae-woong Nah, New York, NY (US);
Satoru Katsurayama, Utsunomiya, JP;
Daisuke Oka, Shizuoka, JP;
Shigefumi Okada, Raleigh, NC (US);
Richard F. Indyk, Wappingers Falls, NY (US);
Jae-Woong Nah, New York, NY (US);
Satoru Katsurayama, Utsunomiya, JP;
Daisuke Oka, Shizuoka, JP;
Shigefumi Okada, Raleigh, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Disco Corporation, Tokyo, JP;
Sumitomo Bakelite Company Ltd., Tokyo, JP;
Abstract
In one embodiment, a dielectric material layer embedding metal structures is ablated from the chip-containing substrate by laser grooving, which is performed on dicing channels of the chip-containing substrate. Subsequently, an underfill layer is formed over the dielectric material layer in a pattern that excludes the peripheral areas of the chip-containing substrate. The physically exposed dicing channels at the periphery can be employed to align a blade to dice the chip-containing substrate. In another embodiment, an underfill layer is formed prior to any laser grooving. Mechanical cutting of the underfill layer from above dicing channels is followed by laser ablation of the dicing channels and subsequent mechanical cutting to dice a chip-containing substrate.