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Disco Corporation

USPTO Granted Patents = 1,568

CIPO Patents = 3

EPO Patents = 12

Trademarks = 36

Forward Citations = 4,414

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719 inventors (with patents filed for the assignee):

Kazuma Sekiya (160 out of 160 patents)

Keiji Nomaru (95 out of 95 patents)

Hiroshi Morikazu (95 out of 95 patents)

4. Masaru Nakamura (75 out of 129 patents)

5. Kazuya Hirata (66 out of 73 patents)

6. Shigenori Harada (52 out of 52 patents)

7. Yoshiaki Yodo (49 out of 49 patents)

8. Hayato Kiuchi (47 out of 52 patents)

9. Karl Heinz Priewasser (45 out of 45 patents)

10. Minoru Matsuzawa (44 out of 46 patents)

11. Masamitsu Agari (44 out of 44 patents)

12. Makiko Ohmae (43 out of 43 patents)

13. Taro Arakawa (41 out of 41 patents)

14. Emiko Kawamura (41 out of 41 patents)

15. Yusuke Vincent Fujii (41 out of 100 patents)

Core Competencies:

Wafer Production

Laser Processing

Substrate Manufacturing

Inspection Methods

Grinding Apparatus

Automatic Risk Assessment

Package Device Manufacturing

Thickness Measurement

Touch Panel Technology

Debris Removal

Single Crystal Silicon

Resin Sheet Manufacturing

1,568 patents: Sort by Forward Citations

1. 12532715 - Processing method of bonded wafer (2026-01-20),

2. 12532685 - Method of processing wafer and laser applying apparatus (2026-01-20),

3. 12532684 - Protective film substance for laser processing and method of processing workpiece (2026-01-20),

4. 12527067 - Wafer processing method and device chip manufacturing method (2026-01-13),

5. 12523865 - Optical part assembly (2026-01-13),

6. 12522522 - Processing wafer regeneration equipment (2026-01-13),

7. 12519019 - Wafer processing method (2026-01-06),

8. 12518973 - Wafer processing method (2026-01-06),

9. 12515373 - Workpiece processing method (2026-01-06),

10. 12512333 - Cleaning apparatus (2025-12-30),

11. 12512314 - Processing method of wafer (2025-12-30),

12. 12508674 - Detection method of resistivity and processing method of plate-shaped workpiece (2025-12-30),

13. 12500123 - Substrate processing method including a burr removing process (2025-12-16),

14. 12496674 - Gettering layer forming device and processing apparatus (2025-12-16),

15. 12494371 - Processing method (2025-12-09),

DISCO CORPORATION is a leading global provider of high-precision, automated cutting, grinding, and polishing solutions. With a commitment to innovation and advanced technology, Disco manufactures and sells precision processing tools and systems used in the production of electronic devices, semiconductors, and other advanced materials. With a strong emphasis on quality and customer satisfaction, Disco has established a solid reputation for delivering cutting-edge solutions for various industries worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 20 2026

1,568 Patents

#70 in Tokyo

#145 in Japan

#620 in the World

Disco Corporation

Forward Citations = 4,414

719 inventors:

Kazuma Sekiya (160 out of 160 patents)

Keiji Nomaru (95 out of 95 patents)

Hiroshi Morikazu (95 out of 95 patents)

4. Masaru Nakamura (75 out of 129 patents)

5. Kazuya Hirata (66 out of 73 patents)

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