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For the Inventor, By the Inventor

Tokyo, Japan

Disco Corporation


USPTO Granted Patents = 1,646

% Expired Patents = 0.18



Trademarks = 21

Forward Citations = 4,579

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748 inventors (with patents filed for the assignee):

goldMedal Kazuma Sekiya (163 out of 163 patents)

silverMedal Hiroshi Morikazu (98 out of 98 patents)

bronzeMedal Keiji Nomaru (96 out of 96 patents)

4.  Masaru Nakamura (80 out of 134 patents)

5.  Kazuya Hirata (70 out of 78 patents)

6.  Shigenori Harada (52 out of 52 patents)

7.  Yoshiaki Yodo (49 out of 49 patents)

8.  Hayato Kiuchi (48 out of 53 patents)

9.  Karl Heinz Priewasser (46 out of 46 patents)

10.  Minoru Matsuzawa (44 out of 46 patents)

11.  Masamitsu Agari (44 out of 44 patents)

12.  Makiko Ohmae (43 out of 43 patents)

13.  Taro Arakawa (41 out of 41 patents)

14.  Emiko Kawamura (41 out of 41 patents)

15.  Yusuke Vincent Fujii (41 out of 100 patents)


Core Competencies:
Wafer Processing
Laser Processing
Chip Manufacturing
Substrate Manufacturing
Grinding Method
Inspection Method
Transfer Apparatus
Protective Member
Dressing Board
Conveying Apparatus
Cleaning Apparatus
Thickness Measuring

1,646 patents:

1. 12734614 - Laser processing apparatus (2026-09-15),
2. 12727445 - Processing method of wafer (2026-09-01),
3. 12727436 - Wafer processing method (2026-09-01),
4. 12727419 - Wafer processing method (2026-09-01),
5. 12722248 - Processing apparatus (2026-09-01),
6. 12722187 - Processing apparatus (2026-09-01),
7. 12721086 - Holding table (2026-08-25),
8. 12721072 - Processing method of bonded wafer (2026-08-25),
9. 12713861 - METHOD OF PROCESSING SiC WAFER (2026-08-18),
10. 12713858 - WAFER PROCESSING METHOD (2026-08-18),
11. 12711600 - METHOD OF DETERMINING HYDROPHILICITY OF WAFER AND PROCESSING APPARATUS (2026-08-18),
12. 12701963 - Expanding machine and expanding method (2026-08-04),
13. 12701942 - Wafer processing apparatus providing cleaning and etching units with separate shrouds and enclosing separate spinner tables (2026-08-04),
14. 12698931 - Cooling mechanism (2026-08-04),
15. 12696735 - Inspecting apparatus, peeling apparatus, and learned model generating method (2026-07-28),
DISCO CORPORATION is a leading global provider of high-precision, automated cutting, grinding, and polishing solutions. With a commitment to innovation and advanced technology, Disco manufactures and sells precision processing tools and systems used in the production of electronic devices, semiconductors, and other advanced materials. With a strong emphasis on quality and customer satisfaction, Disco has established a solid reputation for delivering cutting-edge solutions for various industries worldwide.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Sep 15 2026

Disco Corporation
1,646 Patents

#76 in Tokyo

#143 in Japan

#610 in the World

Tokyo, JP
Tokyo, Japan

Disco Corporation

Forward Citations = 4,579

748 inventors:

goldMedal Kazuma Sekiya (163 out of 163 patents)

silverMedal Hiroshi Morikazu (98 out of 98 patents)

bronzeMedal Keiji Nomaru (96 out of 96 patents)

4.  Masaru Nakamura (80 out of 134 patents)

5.  Kazuya Hirata (70 out of 78 patents)

Please report any incorrect information to [email protected]
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