Disco Corporation, headquartered in Tokyo, specializes in advanced wafer processing technologies essential for semiconductor manufacturing. The company focuses on various core technology areas, including laser processing, grinding methods, and inspection techniques, which are critical in the production of high-performance chips and substrates. Disco's innovative solutions enhance efficiency and precision in chip manufacturing, supporting the evolving demands of the electronics industry and contributing to advancements in technology globally.

Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 6 2026

1,659 Patents

#75 in Tokyo

#141 in Japan

#605 in the World

Tokyo, Japan

Disco Corporation

Forward Citations = 4,579

752 inventors:

Kazuma Sekiya (163 out of 163 patents)

Hiroshi Morikazu (99 out of 99 patents)

Keiji Nomaru (96 out of 96 patents)

4. Masaru Nakamura (80 out of 134 patents)

5. Kazuya Hirata (70 out of 78 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Disco Corporation. Retrieved from https://idiyas.com/company/disco

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

3 patents (CIPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

12 patents (EPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]