The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
Mar. 07, 2022
Disco Corporation, Tokyo, JP;
Masaru Nakamura, Tokyo, JP;
Takenori Takaya, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A method of processing a stacked wafer including a first wafer and a second wafer stacked on a face side of the first wafer, includes positioning a focused spot of a laser beam inside the second wafer inwardly of two sides defining projected dicing lines, and applying the laser beam to the second wafer from an upper surface of the second wafer, thereby forming at least two strips of modified layers inside the second wafer along the projected dicing lines. A tape is affixed to the upper surface of the second wafer, and a projected dicing line is exposed by peeling off the tape from the upper surface of the second wafer to remove residuals of the second wafer that correspond to the projected dicing lines, thereby exposing the projected dicing lines on the face side of the first wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile