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For the Inventor, By the Inventor

Tokyo, Japan

Emiko Kawamura

USPTO Granted Patents = 41

Average Co-Inventor Count = 10.0

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:

goldMedal41 out of 1,556 
 
Disco Corporation
 patents

Years Active: 2020-2023

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Areas of Expertise:
Wafer Processing
Polyolefin Sheet
Polyester Sheet
Ring Frame
Thermocompression Bonding
Protective Sheet Disposal
Laser Beam Division
Division Lines
41 patents (USPTO):Explore Patents
1. 11610815 - Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer (2023-03-21),
2. 11594454 - Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer (2023-02-28),
3. 11587833 - Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer (2023-02-21),
4. 11587832 - Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer (2023-02-21),
5. 11545393 - Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer (2023-01-03),
6. 11476161 - Wafer processing method including applying a polyolefin sheet to a wafer (2022-10-18),
7. 11393721 - Wafer processing method (2022-07-19),
8. 11380588 - Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer (2022-07-05),
9. 11380587 - Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer (2022-07-05),
10. 11361997 - Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer (2022-06-14),
11. 11322407 - Wafer processing method including applying a polyester sheet to a wafer (2022-05-03),
12. 11322406 - Wafer processing method (2022-05-03),
13. 11302578 - Wafer processing method (2022-04-12),
14. 11298928 - Protective sheet disposing method (2022-04-12),
15. 11289379 - Wafer processing method (2022-03-29),

Title: Unveiling the Innovations of Inventor Emiko Kawamura

Introduction: Emiko Kawamura, a prolific inventor based in Tokyo, Japan, has made significant contributions to the field of wafer processing technologies. With an impressive portfolio of 41 patents, Kawamura's revolutionary approach to uniting wafers, ring frames, and polyolefin sheets without the need for adhesive layers has garnered attention worldwide.

Latest Patents: Among Kawamura's latest patents is a cutting-edge wafer processing method that involves the precise positioning of a wafer within a ring frame, utilizing a polyolefin sheet to bond the components through thermocompression. This innovative technique includes a unique process of applying a laser beam to create shield tunnels in the wafer, enabling the division of the wafer into individual device chips with unparalleled efficiency and precision.

Career Highlights: Emiko Kawamura is associated with Disco Corporation, a renowned player in the semiconductor industry known for its advanced technologies in wafer processing equipment. Through his groundbreaking inventions, Kawamura has elevated the standards of wafer processing methodologies, paving the way for enhanced productivity and quality in semiconductor manufacturing.

Collaborations: Kawamura has collaborated closely with esteemed colleagues such as Shigenori Harada and Minoru Matsuzawa, who have contributed significantly to the development and refinement of his innovative processes. Together, they form a dynamic team driving advancements in wafer processing technologies and pushing the boundaries of what is achievable in the semiconductor industry.

Conclusion: Emiko Kawamura's relentless pursuit of innovation and his dedication to revolutionizing wafer processing methodologies have established him as a visionary inventor in the realm of semiconductor technologies. His groundbreaking patents and collaborative efforts underscore his commitment to excellence and his invaluable contributions to the field.

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