The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Oct. 13, 2020
Disco Corporation, Tokyo, JP;
Shigenori Harada, Tokyo, JP;
Minoru Matsuzawa, Tokyo, JP;
Hayato Kiuchi, Tokyo, JP;
Yoshiaki Yodo, Tokyo, JP;
Taro Arakawa, Tokyo, JP;
Masamitsu Agari, Tokyo, JP;
Emiko Kawamura, Tokyo, JP;
Yusuke Fujii, Tokyo, JP;
Toshiki Miyai, Tokyo, JP;
Makiko Ohmae, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.