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For the Inventor, By the Inventor

Tokyo, Japan

Masamitsu Agari

USPTO Granted Patents = 44 

Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:

goldMedal44 out of 1,552 
 
Disco Corporation
 patents

Years Active: 2019-2025

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44 patents (USPTO):
1. 12295174 - Substrate dividing method using an expansion tape and a roller (2025-05-06),
2. 11610815 - Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer (2023-03-21),
3. 11594454 - Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer (2023-02-28),
4. 11587833 - Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer (2023-02-21),
5. 11587832 - Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer (2023-02-21),
6. 11545393 - Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer (2023-01-03),
7. 11476161 - Wafer processing method including applying a polyolefin sheet to a wafer (2022-10-18),
8. 11393721 - Wafer processing method (2022-07-19),
9. 11380588 - Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer (2022-07-05),
10. 11380587 - Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer (2022-07-05),
11. 11361997 - Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer (2022-06-14),
12. 11322407 - Wafer processing method including applying a polyester sheet to a wafer (2022-05-03),
13. 11322406 - Wafer processing method (2022-05-03),
14. 11302578 - Wafer processing method (2022-04-12),
15. 11289379 - Wafer processing method (2022-03-29),

Sure, I can help you with that! Here is an article about inventor Masamitsu Agari:

Title: Innovator Spotlight: Masamitsu Agari, Tokyo's Patent Powerhouse

Introduction:

Masamitsu Agari, a talented inventor hailing from Tokyo, JP, has been on the cutting edge of innovation in the field of wafer processing. With an impressive 43 patents to his name, Agari's groundbreaking work has reshaped the way we approach wafer technology.

Latest Patents:

Agari's latest patents showcase his ingenuity in wafer processing methods. His innovative approach involves uniting a wafer, ring frame, and polyolefin sheet without the need for an adhesive layer. This method not only streamlines the manufacturing process but also enhances the efficiency of device chip production.

Career Highlights:

Agari is a key figure at Disco Corporation, a leading company in the industry. His expertise and groundbreaking patents have solidified his reputation as a pioneer in wafer technology. Agari's contributions have significantly advanced the field and positioned Disco Corporation as a key player in the market.

Collaborations:

Throughout his career, Agari has collaborated with esteemed coworkers such as Shigenori Harada and Minoru Matsuzawa. Together, they have leveraged their collective expertise to push the boundaries of innovation and drive technological advancements in wafer processing.

Conclusion:

Masamitsu Agari's inventive spirit and dedication to excellence have cemented his legacy as a visionary inventor in the realm of wafer processing. His patents not only demonstrate his technical prowess but also highlight his commitment to pushing the boundaries of what is possible in the field. Tokyo's own Masamitsu Agari continues to inspire future generations of inventors with his revolutionary work at Disco Corporation.

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