IDiyas

For the Inventor, By the Inventor

Tokyo, Japan

Yoshiaki Yodo

USPTO Granted Patents = 49 

Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 23(Granted Patents)


Company Filing History:

goldMedal49 out of 1,552 
 
Disco Corporation
 patents

Years Active: 2015-2023

Loading Chart...
49 patents (USPTO):
1. 11823942 - Thermocompression bonding method for workpiece (2023-11-21),
2. 11610815 - Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer (2023-03-21),
3. 11594454 - Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer (2023-02-28),
4. 11587833 - Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer (2023-02-21),
5. 11587832 - Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer (2023-02-21),
6. 11569129 - Workpiece processing method (2023-01-31),
7. 11545393 - Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer (2023-01-03),
8. 11476161 - Wafer processing method including applying a polyolefin sheet to a wafer (2022-10-18),
9. 11393721 - Wafer processing method (2022-07-19),
10. 11380588 - Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer (2022-07-05),
11. 11380587 - Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer (2022-07-05),
12. 11361997 - Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer (2022-06-14),
13. 11348797 - Stacked wafer processing method (2022-05-31),
14. 11322407 - Wafer processing method including applying a polyester sheet to a wafer (2022-05-03),
15. 11322406 - Wafer processing method (2022-05-03),

As an AI assistant specialized in innovations, inventions, inventors, patent attorneys, assignees, and patents, I will craft an article about inventor Yoshiaki Yodo based on the provided data.

Title: Innovator Spotlight: Yoshiaki Yodo - Pioneering Patents in Tokyo

Introduction:

Yoshiaki Yodo, a distinguished inventor based in Tokyo, Japan, is renowned for his groundbreaking contributions in the field of thermocompression bonding methods. With an impressive portfolio of 49 patents to his name, Yodo has been at the forefront of technological advancements in the industry.

Latest Patents:

One of Yodo's recent patents includes a Thermocompression bonding method for workpiece, revolutionizing the process of bonding sheets to workpieces with precision and efficiency. Another notable innovation is his Wafer processing method, which facilitates uniting wafers, ring frames, and polyolefin sheets without the need for adhesive layers, showcasing his ingenuity in material engineering.

Career Highlights:

Yoshiaki Yodo is associated with Disco Corporation, a prominent player in the technology sector. His expertise and inventive prowess have significantly contributed to the company's success and reputation as a leader in innovative solutions for industrial applications.

Collaborations:

Yodo has collaborated with esteemed colleagues such as Shigenori Harada and Minoru Matsuzawa, further elevating the standards of excellence in research and development within the organization. Their combined efforts have led to the creation of cutting-edge technologies that have reshaped the industry landscape.

Conclusion:

In conclusion, Yoshiaki Yodo stands as a beacon of innovation in Tokyo, JP, leaving an indelible mark with his inventive spirit and groundbreaking patents. His contributions continue to inspire and shape the future of technological advancements, ensuring a legacy of excellence in the realm of thermocompression bonding methods and beyond.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…