Tokyo, Japan

Kazuma Sekiya

This inventor holds 163 USPTO granted patents and 34 published patent applications, primarily in Wafer Processing (CPC class H01L21-78). Top assignee: Disco Corporation. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuma Sekiya. Retrieved from https://idiyas.com/inventor/kazuma-sekiya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 163 

% Patents Active = 98.8

Average Co-Inventor Count = 1.1

ph-index = 10

Forward Citations = 736(Granted Patents)

Forward Citations (Not Self Cited) = 693(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Ota-Ku, JP (2009 - 2015)
  • Tokyo, JP (2000 - 2024)

Company Filing History:


Years Active: 2000-2026

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Areas of Expertise:
Wafer Processing
Grinding Apparatus
Polishing Techniques
Manufacturing Methods
Wet Etching
Silicon Wafer
Chip Manufacturing
Protective Sheet
Conveyance System
Dressing Member
Cutting Apparatus
SiC Substrate
163 patents (USPTO):Explore Patents

Title: Kazuma Sekiya: Innovating Machining Systems and Protective Sheet Applications

Introduction:

In the field of innovative machining systems and protective sheet applications, Kazuma Sekiya has emerged as a prominent inventor. With a notable portfolio of patents and a career at Disco Corporation, Sekiya has brought valuable contributions to the industry. This article explores his latest patents, career highlights, and collaborations with colleagues.

Latest Patents:

One of Kazuma Sekiya's recent patents is the "Management Method of Machining System," which introduces an efficient way to manage a machining system. The method involves recording patterns and associated machining conditions in an information recording section. This enables the automatic machining of new types of wafers, with the camera unit capturing images of the new patterns and recording them alongside the corresponding machining conditions.

Another noteworthy patent by Sekiya is the "Protective Sheet Application Apparatus and Method." This invention focuses on the application of protective sheets onto substrates. By utilizing a vacuum chamber and separate compartments, the protective sheets are precisely applied to the front surface of the substrate under controlled conditions. This patent highlights Sekiya's expertise in optimizing manufacturing processes.

Career Highlights:

Throughout his career, Kazuma Sekiya has made significant contributions to Disco Corporation, a renowned precision tools and equipment manufacturing company based in Tokyo, Japan. His dedication to research and development is evident in his impressive portfolio of 143 patents.

Sekiya's expertise lies in the field of machining systems, where he has continuously developed innovative methods and technologies to improve productivity and efficiency. His inventions have pushed the boundaries of process automation and precision, contributing to advancements within the industry.

Collaborations:

Kazuma Sekiya has collaborated closely with colleagues in his pursuit of technological innovation. Notably, he has worked alongside Souichi Ishiwata and Takayuki Umahashi, who share his enthusiasm for advancing machining systems and protective sheet applications. Their collective efforts have resulted in successful collaborative projects within Disco Corporation.

Conclusion:

Through his inventive spirit and dedication to his work, Kazuma Sekiya has made a significant impact on the realms of machining systems and protective sheet applications. With an impressive patent portfolio and a career at Disco Corporation, his pioneering contributions have furthered the boundaries of precision manufacturing. Sekiya's innovative mindset, coupled with collaborations with colleagues, has positioned him as a respected figure within the industry. His work continues to inspire and drive progress in the field of innovation and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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