The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Jul. 21, 2021
Disco Corporation, Tokyo, JP;
Kazuma Sekiya, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
There is provided a processing method of a wafer. The processing method includes a protective sheet preparation step of preparing a protective sheet including a first sheet that is thermocompression-bonded to a surface of the wafer by heating, a second sheet that is laid on the first sheet and has fluidity due to the heating, and a third sheet that is laid on the second sheet and keeps flatness even with the heating. The processing method also includes a protective sheet laying step of causing a side of the first sheet to face a front surface of the wafer and executing heating to execute thermocompression bonding to lay the protective sheet on the front surface of the wafer and a grinding step of causing a side of the protective sheet to be held by a holding surface of a chuck table and grinding a back surface of the wafer.