The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

May. 08, 2024
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Kazuma Sekiya, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32816 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 14/50 (2013.01); H01J 37/32715 (2013.01); H01J 37/32899 (2013.01); H01J 37/34 (2013.01); H01J 2237/332 (2013.01);
Abstract

A wafer processing apparatus includes a holder which holds a wafer by sandwiching an outer circumferential surplus region of the wafer between a face side and a reverse side thereof, a vacuum chamber which houses the holder therein such that the wafer held by the holder defines an upper compartment and a lower compartment in the vacuum chamber, an evacuating unit which evacuates the upper compartment and the lower compartment and developing a positive pressure in the lower compartment with respect to the upper compartment to cancel out flexing of the wafer held by the holder, and a processing unit which is disposed in the vacuum chamber to perform a predetermined process on the wafer held by the holder.


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