The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Nov. 16, 2022
Disco Corporation, Tokyo, JP;
Kazuma Sekiya, Tokyo, JP;
Keiji Nomaru, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A polishing apparatus includes a polishing unit that rotatably supports a polishing pad for polishing a wafer held on a holding surface of a chuck table and that has a spindle formed with a through-hole extending from one end of the spindle to the other end of the spindle in an axis of the spindle. A thickness measuring unit is disposed at one end of the through-hole of the spindle that measures a thickness of the wafer. A controller obtains information regarding the thickness of the wafer measured by the thickness measuring unit at a position defined by a variation in a distance between a rotational center of the rotating wafer fed by a parallel feeding mechanism, a center of the other end of the through-hole facing the wafer, and a rotational angle of the chuck table, and forms mapping data regarding the thickness of the wafer.