The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Jun. 09, 2020
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Tomotaka Tabuchi, Tokyo, JP;

Yuannan Li, Tokyo, JP;

Kazuma Sekiya, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/22 (2006.01); B24B 7/04 (2006.01); B24B 7/06 (2006.01); B24B 7/20 (2006.01); B24B 41/02 (2006.01); B24B 41/06 (2012.01);
U.S. Cl.
CPC ...
B24B 7/228 (2013.01); B24B 7/04 (2013.01); B24B 7/06 (2013.01); B24B 7/20 (2013.01); B24B 41/02 (2013.01); B24B 41/06 (2013.01);
Abstract

A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.


Find Patent Forward Citations

Loading…