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For the Inventor, By the Inventor

Tokyo, Japan

Tomotaka Tabuchi

This inventor holds 11 USPTO granted patents and 1 published patent application. Top assignee: Disco Corporation. Active years: 2005-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomotaka Tabuchi. Retrieved from https://idiyas.com/inventor/tomotaka-tabuchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 90.9

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:

goldMedal11 out of 1,661 
 
Disco Corporation
 patents

Years Active: 2005-2026

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11 patents (USPTO):Explore Patents
1. 12605801 - Chuck table manufacturing method (2026-04-21),
2. 12304027 - Grinding apparatus and use method of grinding apparatus (2025-05-20),
3. 11056346 - Wafer processing method (2021-07-06),
4. 10692721 - Wafer processing method for reforming protective film (2020-06-23),
5. 10468303 - Device chip manufacturing method (2019-11-05),
6. 10354919 - Wafer dividing method (2019-07-16),
7. 10115636 - Processing method for workpiece (2018-10-30),
8. 9330976 - Wafer processing method (2016-05-03),
9. 9123797 - Resin powder wafer processing utilizing a frame with a plurality of partitions (2015-09-01),
10. 9112019 - Wafer processing utilizing a frame with a plurality of partitions (2015-08-18),
11. 6852608 - Production method for semiconductor chip (2005-02-08),

Title: Tomotaka Tabuchi: Innovator in Wafer Processing Technology

Introduction

Tomotaka Tabuchi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing technology, holding a total of 11 patents. His innovative work has advanced the methods and apparatus used in the semiconductor industry.

Latest Patents

Among his latest patents, Tabuchi has developed a grinding apparatus designed to enhance the efficiency of wafer processing. This apparatus features a first chuck table with a porous holding surface that corresponds to a first wafer, as well as a second chuck table for a second wafer of different size or shape. The grinding unit utilizes a grinding wheel to grind either wafer, depending on its position. Additionally, he has created a wafer processing method aimed at reducing the thickness of a wafer. This method involves a plasma etching step that removes the peripheral marginal area of the wafer while using a protective layer as a mask, followed by a protective member attaching step and a grinding step for the back side of the wafer.

Career Highlights

Tabuchi is currently employed at Disco Corporation, where he continues to innovate and develop new technologies in wafer processing. His work has been instrumental in improving the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Some of his notable coworkers include Kazuma Sekiya and Hiroyuki Takahashi, who collaborate with him on various projects within the company.

Conclusion

Tomotaka Tabuchi's contributions to wafer processing technology exemplify his dedication to innovation in the semiconductor industry. His patents and ongoing work at Disco Corporation continue to shape the future of this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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