Tokyo, Japan

Tomotaka Tabuchi

USPTO Granted Patents = 10 

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2005-2025

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10 patents (USPTO):Explore Patents

Title: Tomotaka Tabuchi: Innovator in Wafer Processing Technology

Introduction

Tomotaka Tabuchi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing technology, holding a total of 10 patents. His innovative work has advanced the methods and apparatus used in the semiconductor industry.

Latest Patents

Among his latest patents, Tabuchi has developed a grinding apparatus designed to enhance the efficiency of wafer processing. This apparatus features a first chuck table with a porous holding surface that corresponds to a first wafer, as well as a second chuck table for a second wafer of different size or shape. The grinding unit utilizes a grinding wheel to grind either wafer, depending on its position. Additionally, he has created a wafer processing method aimed at reducing the thickness of a wafer. This method involves a plasma etching step that removes the peripheral marginal area of the wafer while using a protective layer as a mask, followed by a protective member attaching step and a grinding step for the back side of the wafer.

Career Highlights

Tabuchi is currently employed at Disco Corporation, where he continues to innovate and develop new technologies in wafer processing. His work has been instrumental in improving the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Some of his notable coworkers include Kazuma Sekiya and Hiroyuki Takahashi, who collaborate with him on various projects within the company.

Conclusion

Tomotaka Tabuchi's contributions to wafer processing technology exemplify his dedication to innovation in the semiconductor industry. His patents and ongoing work at Disco Corporation continue to shape the future of this critical field.

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