The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Jul. 22, 2021
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Kazuma Sekiya, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/40 (2014.01); B23K 103/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/40 (2013.01); H01L 21/78 (2013.01); B23K 2103/56 (2018.08);
Abstract
A wafer manufacturing method for manufacturing a wafer from an ingot includes forming a peeling layer within the ingot by positioning a condensing point at a depth corresponding to the thickness of the wafer to be produced, and irradiating the ingot with a first laser beam, forming a character, a number, or a mark representing information regarding resistivity in or on the ingot by positioning a condensing point in a region in which devices are not to be formed and irradiating the ingot with a second laser beam, and dividing the ingot with the peeling layer as a starting point.