The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2025
Filed:
Apr. 13, 2022
Disco Corporation, Tokyo, JP;
Kazuma Sekiya, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer processing method includes a wafer accommodating step of accommodating a wafer in a vacuum chamber, a protective sheet disposing step of disposing a protective sheet on a front surface of the wafer, a decompression step of decompressing the inside of the vacuum chamber, after the wafer accommodating step and the protective sheet disposing step, a press-fitting step of pressing the protective sheet against a peripheral marginal area of the wafer in the vacuum chamber to press-fit the protective sheet to the peripheral marginal area, after the decompression step, and a conveying-out step of opening the vacuum chamber to atmosphere to bring the protective sheet into close contact with the front surface of the wafer by atmospheric pressure and conveying out the wafer, after the press-fitting step.