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For the Inventor, By the Inventor

Munich, Germany

Karl Heinz Priewasser

USPTO Granted Patents = 45 

Average Co-Inventor Count = 1.3

ph-index = 4

Forward Citations = 315(Granted Patents)


Company Filing History:

goldMedal45 out of 1,552 
 
Disco Corporation
 patents

Years Active: 2006-2025

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45 patents (USPTO):
1. 12472581 - Method of processing a substrate and system for processing a substrate (2025-11-18),
2. 12224207 - Method of processing a workpiece and system for processing a workpiece (2025-02-11),
3. 12094751 - Method of processing a substrate (2024-09-17),
4. 12062533 - Method of producing a substrate and system for producing a substrate (2024-08-13),
5. 11894271 - Method of processing wafer (2024-02-06),
6. 11823941 - Method of processing a substrate (2023-11-21),
7. 11784138 - Wafer processing with a protective film and peripheral adhesive (2023-10-10),
8. 11676833 - Protective sheet for use in processing wafer, handling system for wafer, and combination of wafer and protective sheeting (2023-06-13),
9. 11637074 - Method of processing wafer (2023-04-25),
10. 11626324 - Method of processing a wafer (2023-04-11),
11. 11559974 - Microfluidic system or device and method of manufacturing a microfluidic system or device (2023-01-24),
12. 11437275 - Method of processing wafer and protective sheeting for use in this method (2022-09-06),
13. 11424161 - Substrate processing method (2022-08-23),
14. 11201126 - Method of producing a substrate and system for producing a substrate (2021-12-14),
15. 11133219 - Method of processing a wafer (2021-09-28),

Title: Karl Heinz Priewasser: Pioneering Innovations in Substrate Production

Introduction:

Karl Heinz Priewasser, a visionary inventor based in Munich, Germany, is a trailblazer in the technological landscape. With a remarkable portfolio of 42 patents, his inventive prowess has been instrumental in shaping the future of various industries globally. Priewasser's relentless pursuit of innovation serves as a beacon of inspiration for aspiring inventors and entrepreneurs alike.

Latest Patents:

Priewasser's latest patents showcase his cutting-edge contributions to the field of substrate production. One notable invention is a method for producing a substrate that involves attaching a carrier to a workpiece, forming a modified layer, and ultimately obtaining the substrate by dividing the workpiece. Additionally, he has developed a method for processing wafers that includes preparation, measurement etching, thickness adjustment, and final etching steps to ensure precise wafer processing.

Career Highlights:

Currently employed at Disco Corporation, Priewasser continues to push the boundaries of innovation in substrate technology. His groundbreaking research and inventions have garnered international recognition, solidifying his reputation as a visionary in the industry. Priewasser's dedication to driving technological advancements underscores his significant contributions to the evolution of substrate production methodologies.

Collaborations:

Throughout his career, Priewasser has collaborated with esteemed colleagues such as Hitoshi Hoshino and Hiroshi Morikazu. Together, they have synergized their expertise to tackle complex technological challenges and drive forward innovative solutions in the realm of substrate production. Priewasser's collaborative spirit and teamwork have been integral to the success of various projects and endeavors.

Conclusion:

In conclusion, Karl Heinz Priewasser stands at the forefront of innovation in substrate production, with a remarkable track record of patents and technological advancements to his name. His contributions have not only reshaped industries but have also inspired a new generation of inventors and entrepreneurs to strive for excellence in the ever-evolving technological landscape. As Priewasser continues to pave the way for future innovations, his legacy as a pioneering inventor remains as impactful as ever.

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