The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Mar. 19, 2020
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Karl Heinz Priewasser, Munich, DE;

Tzanimir Arguirov, Munich, DE;

Yasuyoshi Yubira, Munich, DE;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); B23K 26/53 (2014.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); B23K 26/0622 (2014.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/0622 (2015.10); B23K 26/53 (2015.10); H01L 21/304 (2013.01); H01L 21/6836 (2013.01); H01L 21/76894 (2013.01); H01L 23/544 (2013.01); H01L 23/562 (2013.01);
Abstract

A substrate having a first surface with at least one division line and an opposite second surface is processed by attaching a protective sheeting to the first surface and applying a laser beam to the protective sheeting to form a plurality of alignment marks in the protective sheeting. The substrate has a backside layer on the second surface. A laser beam is applied to the substrate from the side of the first surface. The substrate is transparent to the laser beam and the focal point of the laser beam is located inside the substrate which is closer to the second surface than to the first surface, to form a plurality of alignment marks in the backside layer. Substrate material is removed along the division line from the side of the second surface. The alignment marks are used for aligning the substrate material removing means relative to the division line.


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