Shigefumi Okada

Title: Shigefumi Okada: Innovator in Wafer Processing Technology

Introduction

Shigefumi Okada is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in wafer processing methods. With a total of 5 patents to his name, Okada's work has advanced the efficiency and effectiveness of semiconductor manufacturing.

Latest Patents

One of Okada's latest patents is a wafer processing method designed to form a modified layer within a wafer along planned dividing lines. This innovative method positions a condensing point within the wafer or at its top surface and applies a second laser beam while moving the condensing point. The process involves imaging reflected light to determine the processed state of the wafer based on the imaged image. Notably, the second laser beam is configured such that its sectional shape in a plane perpendicular to its traveling direction is not axisymmetric with respect to the axis along the planned dividing lines.

Another significant patent is related to a stress-resilient chip structure and dicing process. This invention features a substrate that includes multiple semiconductor chips arranged in a grid pattern, with channel regions providing lateral spacing. The substrate consists of a vertical stack of a semiconductor layer and at least one dielectric material layer embedding metal interconnect structures. The dielectric material layers are removed along the channel regions and around the vertices of the grid pattern, allowing each semiconductor chip to have corner surfaces that are not parallel to the grid lines. This design reduces mechanical stress on the metal interconnect layer during bonding and thermal cycling processes.

Career Highlights

Throughout his career, Shigefumi Okada has worked with notable companies, including Disco Corporation and IBM. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Okada has collaborated with esteemed colleagues, including Richard Francis Indyk and Jae-Woong Nah. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Shigefumi Okada's contributions to wafer processing technology exemplify his dedication to innovation in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in semiconductor manufacturing, and his work continues to influence the field significantly.