The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Oct. 08, 2013
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Shigefumi Okada, Tokyo, JP;

Nobumori Ogoshi, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); B23K 26/40 (2014.01); B23K 26/00 (2014.01); B23K 26/04 (2014.01); B23K 26/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/4075 (2013.01); B23K 26/0057 (2013.01); B23K 26/045 (2013.01); B23K 26/10 (2013.01);
Abstract

During the performance of a laser processing step of applying a laser beam to a wafer to form modified layers inside the wafer respectively along division lines, a predetermined one of the modified layers already formed is imaged by a camera from the back side of the wafer with predetermined timing, and a positional deviation of the predetermined modified layer from the corresponding division line is detected to calculate a correction value. Then, the correction value is added to data on applied position of the laser beam to thereby make the applied position of the laser beam coincide with each division line. Accordingly, a positional deviation of the modified layer to be formed after this correction from each division line can be suppressed.


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