The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
Apr. 05, 2005
Jon A. Casey, Poughkeepsie, NY (US);
James G. Balz, Walden, NY (US);
Michael Berger, New Paltz, NY (US);
Jerome Cohen, Poughquag, NY (US);
Charles Hendricks, Wappingers Falls, NY (US);
Richard Indyk, Wappingers Falls, NY (US);
Mark Laplante, Montgomery, NY (US);
David C. Long, Wappingers Falls, NY (US);
Lori A. Maiorino, Wappingers Falls, NY (US);
Arthur G. Merryman, Hopewell Junction, NY (US);
Glenn A. Pomerantz, Kerhonkson, NY (US);
Robert A. Rita, Manlius, NY (US);
Krystyna W. Semkow, Poughquag, NY (US);
Patrick E. Spencer, Rochester, NY (US);
Brian R. Sundlof, Beacon, NY (US);
Richard P. Surprenant, Poughkeepsie, NY (US);
Donald R. Wall, Poughkeepsie, NY (US);
Thomas A. Wassick, Lagrangeville, NY (US);
Kathleen M. Wiley, Wappingers Falls, NY (US);
Jon A. Casey, Poughkeepsie, NY (US);
James G. Balz, Walden, NY (US);
Michael Berger, New Paltz, NY (US);
Jerome Cohen, Poughquag, NY (US);
Charles Hendricks, Wappingers Falls, NY (US);
Richard Indyk, Wappingers Falls, NY (US);
Mark LaPlante, Montgomery, NY (US);
David C. Long, Wappingers Falls, NY (US);
Lori A. Maiorino, Wappingers Falls, NY (US);
Arthur G. Merryman, Hopewell Junction, NY (US);
Glenn A. Pomerantz, Kerhonkson, NY (US);
Robert A. Rita, Manlius, NY (US);
Krystyna W. Semkow, Poughquag, NY (US);
Patrick E. Spencer, Rochester, NY (US);
Brian R. Sundlof, Beacon, NY (US);
Richard P. Surprenant, Poughkeepsie, NY (US);
Donald R. Wall, Poughkeepsie, NY (US);
Thomas A. Wassick, Lagrangeville, NY (US);
Kathleen M. Wiley, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.