Lori A Maiorino

Title: Lori A Maiorino: Innovator in Electronic Package Repair Processes

Introduction

Lori A Maiorino is a distinguished inventor based in Wappingers Falls, NY (US). She has made significant contributions to the field of electronic package repair, holding three patents to her name. Her innovative work focuses on enhancing the reliability and efficiency of multilayer ceramic substrates.

Latest Patents

One of her latest patents is an electronic package repair process that introduces a new electrical repair path to connect top surface vias. This multilayer ceramic repair process establishes a connection between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is utilized to form post-fired circuitry on and within the substrate. This process is followed by the electrical isolation of the defective net from the electrical repair structure and the passivation of the electrical repair line.

Career Highlights

Lori A Maiorino is currently employed at International Business Machines Corporation (IBM), where she continues to innovate and develop new technologies. Her work has been instrumental in advancing electronic packaging solutions, making her a valuable asset to her team and the industry.

Collaborations

Some of her notable coworkers include Jon Alfred Casey and James G Balz, who have collaborated with her on various projects within the realm of electronic packaging.

Conclusion

Lori A Maiorino's contributions to electronic package repair processes exemplify her dedication to innovation and excellence in her field. Her patents reflect her commitment to improving technology and enhancing the functionality of electronic devices.