The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2004
Filed:
Mar. 28, 2003
Mark J. LaPlante, Montgomery, NY (US);
Jon A. Casey, Poughkeepsie, NY (US);
Thomas A. Wassick, Lagrangeville, NY (US);
David C. Long, Wappingers Falls, NY (US);
Krystyna W. Semkow, Poughquag, NY (US);
Patrick E. Spencer, Rochester, NY (US);
Robert A. Rita, Manlius, NY (US);
Richard F. Indyk, Wappingers Falls, NY (US);
Kathleen M. Wiley, Wappingers Falls, NY (US);
Brian R. Sundlof, Beacon, NY (US);
James Balz, Walden, NY (US);
Lori A. Maiorino, Wappingers Falls, NY (US);
Donald R. Wall, Poughkeepsie, NY (US);
Glenn A. Pomerantz, Kerhonkson, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing the substrate surface. The first path connects at least one conductive via on the top surface of the substrate. A second path is cut through the second layer of tape exposing the first layer of tape. The second path is routed from the first path to an edge of the substrate A seed layer is deposited over the surface of the second layer of tape thereby creating a seeded plating path in the first path and a sacrificial seeded conduction path in the second path. Connecting the sacrificial seeded conduction path to a plating potential at the edge of the substrate creates a plated path on the surface of the substrate. The sacrificial path is removed when the tape is removed.