Maybrook, NY, United States of America

James G Balz


Average Co-Inventor Count = 5.4

ph-index = 7

Forward Citations = 186(Granted Patents)


Location History:

  • Maybrook, NY (US) (1995 - 2001)
  • Walden, NY (US) (1999 - 2007)

Company Filing History:


Years Active: 1995-2007

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22 patents (USPTO):

Title: Innovations of James G. Balz in Electronic Package Repair

Introduction: James G. Balz, an accomplished inventor based in Maybrook, NY, has made significant contributions to the field of electronic package repair. With an impressive portfolio comprising 22 patents, Balz continues to push the boundaries of technology, particularly in multilayer ceramic substrates.

Latest Patents: Among his notable inventions is the "Electronic Package Repair Process," which involves a multilayer ceramic repair method that creates a new electrical repair path to connect top surface vias. This innovative process establishes a link between a defective net and a redundant repair net within the multilayer ceramic substrate. Both the defective net and the repair net terminate at surface vias of the substrate, enabling efficient circuitry repair. The use of a laser to form post-fired circuitry enhances the precision of the repair. This is further complemented by the electrical isolation of the defective net from the electrical repair structure and the passivation of the electrical repair line, ensuring a reliable solution for electronic packages.

Career Highlights: James G. Balz's career is marked by his role at the International Business Machines Corporation (IBM), a leading company in technology and innovation. His work at IBM has allowed him to collaborate with some of the finest in the industry, continually advancing the field of electronic repair systems.

Collaborations: Throughout his career, Balz has worked alongside esteemed colleagues such as David Clifford Long and Mark J. LaPlante. These collaborative efforts have resulted in groundbreaking innovations that enhance the reliability and efficiency of electronic components.

Conclusion: James G. Balz’s contributions to the field of electronic package repair are a testament to his innovative spirit and technical expertise. With a solid number of patents and significant collaborations at IBM, he is poised to continue shaping the future of electronic repairs. His work stands as an inspiration to aspiring inventors and highlights the importance of innovation in technology.

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