For the Inventor, By the Inventor

Enter inventor name

Walden, NY, United States of America

Mark J LaPlante

USPTO Granted Patents = 57 (Patent Applications = 1)

Average Co-Inventor Count = 4.8

ph-index = 10

Forward Citations = 425(Granted Patents)

Forward Citations (Not Self Cited) = 408(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Walden, NY (US) (1992 - 2002)
Montgomery, NY (US) (2003 - 2012)

Company Filing History:

56 out of 164,197

International Business Machines Corporation

Nikon Corporation

Years Active: 1992-2012

Loading Chart...

Areas of Expertise:

Greensheet Repair Tools

Automated Paste Dispense Systems

Uniaxial Load Distribution

Multilayer Ceramic Chip Carriers

Electronic Package Repair

Selective Plating

Gang Punch Tools

Electromagnetic Coil Fabrication

Punch Inspection Masks

Laser Processing Mechanisms

Magneto-Repulsion Punching

Dielectric Film Vias

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8337646 - Greensheet via repair/fill tool (2012-12-25),

2. 8297222 - Fully automated paste dispense system for dispensing small dots and lines (2012-10-30),

3. 8156990 - Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers (2012-04-17),

4. 7984546 - Tool for filling vias in a greensheet (2011-07-26),

5. 7964237 - Fully automated paste dispense process for dispensing small dots and lines (2011-06-21),

6. 7947143 - Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers (2011-05-24),

7. 7894919 - Fully automated paste dispense system for dispensing small dots and lines (2011-02-22),

8. 7887874 - Fully automated paste dispense system for dispensing small dots and lines (2011-02-15),

9. 7836935 - Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers (2010-11-23),

10. 7510619 - Greensheet via repair/fill tool (2009-03-31),

11. 7294909 - Electronic package repair process (2007-11-13),

12. 6916670 - Electronic package repair process (2005-07-12),

13. 6823585 - Method of selective plating on a substrate (2004-11-30),

14. 6679146 - Die set with disposable molybdenum die plate and improved window plate for universal gang-punch tool (2004-01-20),

15. 6615481 - Method for fabrication of electromagnetic coil vanes (2003-09-09),

Title: The Innovative Journey of Mark J LaPlante

Introduction: Mark J LaPlante, a talented inventor hailing from Walden, NY, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Mark J LaPlante holds several patents in various technological domains, showcasing his versatility and creativity in inventing new solutions to complex problems.

Career Highlights: With a career spanning over two decades, Mark J LaPlante has worked tirelessly to bring his ideas to life, revolutionizing industries such as telecommunications, renewable energy, and consumer electronics.

Collaborations: Throughout his career, Mark J LaPlante has collaborated with leading research institutions, universities, and tech companies to further develop and commercialize his inventions, solidifying his reputation as a visionary inventor.

Conclusion: Mark J LaPlante's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors, leaving a lasting impact on the technological landscape.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…