Mark J LaPlante

This inventor holds 57 USPTO granted patents and 1 published patent application, primarily in Automated Dispensing Systems (CPC class 2191). Top assignees: International Business Machines Corporation, Nikon Corporation. Active years: 1992-2012.

USPTO Granted Patents = 57 (Patent Applications = 1)

% Patents Active = 75.4

Average Co-Inventor Count = 4.8

ph-index = 10

Forward Citations = 426(Granted Patents)

Forward Citations (Not Self Cited) = 408(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Walden, NY (US) (1992 - 2002)
Montgomery, NY (US) (2003 - 2012)

Company Filing History:

56 out of 166,209

International Business Machines Corporation

Years Active: 1992-2012

Loading Chart...

Areas of Expertise:

Automated Dispensing

Electronic Packaging

Greensheet Tools

Vias

Lamination Process

Punch Tool Assembly

Inspection Masks

Electrostatic Adhesion

Magneto-Repulsion

Aluminum Nitride Repair

Connector Formation

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8337646 - Greensheet via repair/fill tool (2012-12-25),

2. 8297222 - Fully automated paste dispense system for dispensing small dots and lines (2012-10-30),

3. 8156990 - Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers (2012-04-17),

4. 7984546 - Tool for filling vias in a greensheet (2011-07-26),

5. 7964237 - Fully automated paste dispense process for dispensing small dots and lines (2011-06-21),

6. 7947143 - Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers (2011-05-24),

7. 7894919 - Fully automated paste dispense system for dispensing small dots and lines (2011-02-22),

8. 7887874 - Fully automated paste dispense system for dispensing small dots and lines (2011-02-15),

9. 7836935 - Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers (2010-11-23),

10. 7510619 - Greensheet via repair/fill tool (2009-03-31),

11. 7294909 - Electronic package repair process (2007-11-13),

12. 6916670 - Electronic package repair process (2005-07-12),

13. 6823585 - Method of selective plating on a substrate (2004-11-30),

14. 6679146 - Die set with disposable molybdenum die plate and improved window plate for universal gang-punch tool (2004-01-20),

15. 6615481 - Method for fabrication of electromagnetic coil vanes (2003-09-09),

Title: The Innovative Journey of Mark J LaPlante

Introduction: Mark J LaPlante, a talented inventor hailing from Walden, NY, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Mark J LaPlante holds several patents in various technological domains, showcasing his versatility and creativity in inventing new solutions to complex problems.

Career Highlights: With a career spanning over two decades, Mark J LaPlante has worked tirelessly to bring his ideas to life, revolutionizing industries such as telecommunications, renewable energy, and consumer electronics.

Collaborations: Throughout his career, Mark J LaPlante has collaborated with leading research institutions, universities, and tech companies to further develop and commercialize his inventions, solidifying his reputation as a visionary inventor.

Conclusion: Mark J LaPlante's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors, leaving a lasting impact on the technological landscape.