International Business Machines Corporation

Nikon Corporation

Mark J LaPlante

David Clifford Long

James G Balz

Thomas Weiss

Keith C O'Neil

John Ulrich Knickerbocker

Mark William Kapfhammer

William Dale Carbaugh, Jr

Jon Alfred Casey

Joshua Monroe Cobb

Glenn A Pomerantz

Uldis Artis Ziemins

Donald Rene Wall

Brenda Lee Peterson

Daniel Guilford Patterson

Candace J Freedenberg

James N Humenik

David B Goland

Christopher D Setzer

Govindarajan Natarajan

Thomas Anthony Wassick

Krystyna Waleria Semkow

Lester W Herron

Brian Richard Sundlof

Robert Anthony Rita

Richard Francis Indyk

Kevin M Prettyman

Robert P Westerfield, Jr

Hsichang Liu

Renee L Weisman

Jay A Bunt

Candace A Sullivan

Donald W Diangelo

Nabil A Rizk

Daniel S Mackin

Kathleen M Wiley

Cynthia J Calli

Kathleen Mary McGuire

Karl Friedrich Stroms

Thomas A Kline

James Robert Wylder

Patrick E Spencer

Darren T Cook

Joseph Christopher Saltarelli

Michael Thomas Puchalski

Cristian Docu

Thomas Foley

Melvin R Gottschalk, Jr

Lisa A Hamilton

Sebastian Loscerbo

Olga A Otieno

Lori A Maiorino

Laertis Economikos

Benjamin V Fasano

Raschid Jose Bezama

Arthur Gilman Merryman

Michael Berger

Charles J Hendricks

Richard Philip Surprenant

Jerome D Cohen

Timothy Titus Popp

Krishna Gandhi Sachdev

Subhash Laxman Shinde

Mario John Interrante

Scott Marshall Mansfield

Thomas Edward Lombardi

Mukta S Farooq

Luc Gilbert Guerin

Gregory M Johnson

Dale Curtis McHerron

David J Pinckney

Anton Nenadic

Gregory Blair Martin

Thomas P Moyer

John R Lankard

Ferdinand D DiMaria

Franz X Topolovec

Alan Piciacchio

Lawrence D Thorp

Gerhard Weiss

John Joseph Seksinsky

Poyang Lu

Mark G LaVine

Howard A Bender, Iii

A method and apparatus are provided for filling vias in a product greensheet and/or repairing vias in a product greensheet. The method and apparatus utilize a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The method and apparatus employ position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the method. The product greensheet is held by a vacuum plate.

Greensheet via repair/fill tool

A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.

Fully automated paste dispense system for dispensing small dots and lines

An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers

An apparatus tool for filling vias in a product greensheet and/or repairing vias in a product greensheet. The apparatus tool utilizes a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The apparatus tool employs position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the repair or fill method. The product greensheet is held by a vacuum plate.

Tool for filling vias in a greensheet

Fully automated paste dispense process for dispensing small dots and lines

Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers

A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Electronic package repair process

A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing the substrate surface. The first path connects at least one conductive via on the top surface of the substrate. A second path is cut through the second layer of tape exposing the first layer of tape. The second path is routed from the first path to an edge of the substrate A seed layer is deposited over the surface of the second layer of tape thereby creating a seeded plating path in the first path and a sacrificial seeded conduction path in the second path. Connecting the sacrificial seeded conduction path to a plating potential at the edge of the substrate creates a plated path on the surface of the substrate. The sacrificial path is removed when the tape is removed.

Method of selective plating on a substrate

A die and method of gang punching selective holes in thin sheet materials such as greensheets are provided in which slugs of greensheet material formed during the punching operation easily fall through the die and are removed. The die uses a number of plates one of which is a window plate having openings corresponding to openings in a die plate disposed thereon. The window plate openings have a larger diameter than the die plate openings and also a plurality have an oval shape which oval shape openings provide less resistance to the falling slugs and facilitate removal of the slugs from the die. The window plate also preferably has a central grid open area with the remainder of the plate having vertical through-holes corresponding to the through-holes of the die plate. The die also preferably employs a die plate made from at least two sheets of material, i.e., an upper disposable sheet (die plate) and a lower sheet (sub-die plate) wherein the upper die plate is made from a wear-resistant material such as molybdenum. The upper die plate is preferably made by photolithography techniques.

Die set with disposable molybdenum die plate and improved window plate for universal gang-punch tool

The present invention relates to a method of fabricating electromagnetic coil vanes. The method utilizes laser machining to provide high resolution, dense coil wire patterns on both sides of a ceramic vane substrate. A firing operation is first performed that eutectically bonds the copper to the ceramic. Laser machining is then used to produce a coil pattern in the copper. The substrate is drilled to provide a through hole which, when filled or partially filled with a conducting material, forms an electrical connection between the two coil patterns.

Method for fabrication of electromagnetic coil vanes

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Walden, NY, United States of America

Mark J LaPlante