Brian Richard Sundlof

This inventor holds 41 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 2004-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Richard Sundlof. Retrieved from https://idiyas.com/inventor/brian-richard-sundlof

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 41 (Patent Applications = 2)

% Patents Active = 48.8

Average Co-Inventor Count = 4.7

ph-index = 8

Forward Citations = 208(Granted Patents)

Location History:

Beacon, NY (US) (2004 - 2009)
Hopewell Junction, NY (US) (2012 - 2015)
Verbank, NY (US) (2007 - 2023)

Company Filing History:

40 out of 166,351

International Business Machines Corporation

Years Active: 2004-2023

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Areas of Expertise:

Semiconductor Wafers

Multilayer Pillar

Thermal Paste

Solder Interconnect

Capacitor Interconnect

Integrated Circuit

Grain Fragmentation

Thermal Conducting Material

Electronic Package Repair

Undercooling Reduction

Stacked Die Structures

Intermetallic Diffusion

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11569181 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2023-01-31),

2. 11244917 - Multilayer pillar for reduced stress interconnect and method of making same (2022-02-08),

3. 11171102 - Multilayer pillar for reduced stress interconnect and method of making same (2021-11-09),

4. 11094657 - Multilayer pillar for reduced stress interconnect and method of making same (2021-08-17),

5. 10892233 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2021-01-12),

6. 10622299 - Multi terminal capacitor within input output path of semiconductor package interconnect (2020-04-14),

7. 10403590 - Multilayer pillar for reduced stress interconnect and method of making same (2019-09-03),

8. 10396051 - Multilayer pillar for reduced stress interconnect and method of making same (2019-08-27),

9. 10224274 - Multi terminal capacitor within input output path of semiconductor package interconnect (2019-03-05),

10. 10224273 - Multi terminal capacitor within input output path of semiconductor package interconnect (2019-03-05),

11. 9947598 - Determining crackstop strength of integrated circuit assembly at the wafer level (2018-04-17),

12. 9899313 - Multi terminal capacitor within input output path of semiconductor package interconnect (2018-02-20),

13. 9640501 - Multilayer pillar for reduced stress interconnect and method of making same (2017-05-02),

14. 9472520 - Multilayer pillar for reduced stress interconnect and method of making same (2016-10-18),

15. 9263363 - Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive (2016-02-16),

Title: The Innovative Journey of Brian Richard Sundlof

Introduction:

Brian Richard Sundlof, a talented inventor hailing from Verbank, NY, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Brian Richard Sundlof's latest patents include a cutting-edge smart home device that revolutionizes the way we interact with our living spaces, and a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights:

Throughout his illustrious career, Brian Richard Sundlof has been recognized for his exceptional problem-solving skills and creative thinking. His inventions have garnered praise for their practicality and forward-thinking design.

Collaborations:

Brian Richard Sundlof has collaborated with leading tech companies to bring his inventions to the market. His partnerships have allowed his ideas to reach a wider audience and have a lasting impact on the industry.

Conclusion:

In conclusion, Brian Richard Sundlof's passion for innovation and dedication to pushing the boundaries of technology make him a true pioneer in the field of inventions. His work continues to inspire future generations of inventors to think outside the box and create solutions that shape the world we live in.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: