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For the Inventor, By the Inventor

Verbank, NY, United States of America

Brian Richard Sundlof

USPTO Granted Patents = 41 

Average Co-Inventor Count = 4.7

ph-index = 8

Forward Citations = 206(Granted Patents)


Location History:

  • Beacon, NY (US) (2004 - 2009)
  • Hopewell Junction, NY (US) (2012 - 2015)
  • Verbank, NY (US) (2007 - 2023)

Company Filing History:

goldMedal40 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal1 out of 5,671 
 
Globalfoundries Inc.
 patents

Years Active: 2004-2023

where 'Filed Patents' based on already Granted Patents

41 patents (USPTO):
1. 11569181 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2023-01-31),
2. 11244917 - Multilayer pillar for reduced stress interconnect and method of making same (2022-02-08),
3. 11171102 - Multilayer pillar for reduced stress interconnect and method of making same (2021-11-09),
4. 11094657 - Multilayer pillar for reduced stress interconnect and method of making same (2021-08-17),
5. 10892233 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2021-01-12),
6. 10622299 - Multi terminal capacitor within input output path of semiconductor package interconnect (2020-04-14),
7. 10403590 - Multilayer pillar for reduced stress interconnect and method of making same (2019-09-03),
8. 10396051 - Multilayer pillar for reduced stress interconnect and method of making same (2019-08-27),
9. 10224274 - Multi terminal capacitor within input output path of semiconductor package interconnect (2019-03-05),
10. 10224273 - Multi terminal capacitor within input output path of semiconductor package interconnect (2019-03-05),
11. 9947598 - Determining crackstop strength of integrated circuit assembly at the wafer level (2018-04-17),
12. 9899313 - Multi terminal capacitor within input output path of semiconductor package interconnect (2018-02-20),
13. 9640501 - Multilayer pillar for reduced stress interconnect and method of making same (2017-05-02),
14. 9472520 - Multilayer pillar for reduced stress interconnect and method of making same (2016-10-18),
15. 9263363 - Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive (2016-02-16),

Title: The Innovative Journey of Brian Richard Sundlof

Introduction:

Brian Richard Sundlof, a talented inventor hailing from Verbank, NY, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Brian Richard Sundlof's latest patents include a cutting-edge smart home device that revolutionizes the way we interact with our living spaces, and a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights:

Throughout his illustrious career, Brian Richard Sundlof has been recognized for his exceptional problem-solving skills and creative thinking. His inventions have garnered praise for their practicality and forward-thinking design.

Collaborations:

Brian Richard Sundlof has collaborated with leading tech companies to bring his inventions to the market. His partnerships have allowed his ideas to reach a wider audience and have a lasting impact on the industry.

Conclusion:

In conclusion, Brian Richard Sundlof's passion for innovation and dedication to pushing the boundaries of technology make him a true pioneer in the field of inventions. His work continues to inspire future generations of inventors to think outside the box and create solutions that shape the world we live in.

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