Krystyna Waleria Semkow

This inventor holds 50 USPTO granted patents and 2 published patent applications, primarily in Interconnect Technology (CPC class H01L). Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1992-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Krystyna Waleria Semkow. Retrieved from https://idiyas.com/inventor/krystyna-waleria-semkow

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 50 (Patent Applications = 2)

% Patents Active = 56.0

Average Co-Inventor Count = 4.1

ph-index = 8

Forward Citations = 497(Granted Patents)

Forward Citations (Not Self Cited) = 466(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Johnson City, NY (US) (1992)
Poughquang, NY (US) (2014)
Hopewell Junction, NY (US) (2013 - 2016)
Poughquag, NY (US) (1994 - 2022)

Company Filing History:

49 out of 166,409

International Business Machines Corporation

Years Active: 1992-2022

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Areas of Expertise:

Multilayer Pillar

Electromigration

Lead-Free Solder

Under Ball Metallurgy

Copper Plug

Current Carrying Capability

Solder Ball

Bump Pad Metallurgy

Selective Plating

Electronic Package Repair

Nickel Alloy Plating

Grain Fragmentation

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11244917 - Multilayer pillar for reduced stress interconnect and method of making same (2022-02-08),

2. 11171102 - Multilayer pillar for reduced stress interconnect and method of making same (2021-11-09),

3. 11094657 - Multilayer pillar for reduced stress interconnect and method of making same (2021-08-17),

4. 10403590 - Multilayer pillar for reduced stress interconnect and method of making same (2019-09-03),

5. 10396051 - Multilayer pillar for reduced stress interconnect and method of making same (2019-08-27),

6. 9640501 - Multilayer pillar for reduced stress interconnect and method of making same (2017-05-02),

7. 9472520 - Multilayer pillar for reduced stress interconnect and method of making same (2016-10-18),

8. 9379007 - Electromigration-resistant lead-free solder interconnect structures (2016-06-28),

9. 9142501 - Under ball metallurgy (UBM) for improved electromigration (2015-09-22),

10. 9111816 - Multilayer pillar for reduced stress interconnect and method of making same (2015-08-18),

11. 9084378 - Under ball metallurgy (UBM) for improved electromigration (2015-07-14),

12. 9035459 - Structures for improving current carrying capability of interconnects and methods of fabricating the same (2015-05-19),

13. 8922019 - Semiconductor device having a copper plug (2014-12-30),

14. 8910853 - Additives for grain fragmentation in Pb-free Sn-based solder (2014-12-16),

15. 8803317 - Structures for improving current carrying capability of interconnects and methods of fabricating the same (2014-08-12),

Title: Krystyna Waleria Semkow: A Trailblazing Inventor from Poughquag, NY

Introduction: Krystyna Waleria Semkow, a distinguished inventor hailing from Poughquag, NY, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Krystyna Waleria Semkow's latest patents include cutting-edge inventions in the realm of renewable energy, sustainable materials, and advanced robotics.

Career Highlights: Throughout his illustrious career, Krystyna Waleria Semkow has received numerous accolades for his innovative work, including the prestigious Inventor of the Year award and multiple patents for his revolutionary creations.

Collaborations: Krystyna Waleria Semkow has collaborated with leading research institutions, universities, and tech companies to further develop and implement his pioneering inventions, solidifying his reputation as a visionary in the industry.

Conclusion: Krystyna Waleria Semkow's relentless passion for innovation and his unwavering commitment to pushing the boundaries of technology continue to inspire generations of inventors and pave the way for a brighter, more sustainable future.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: