The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
May. 01, 2013
Globalfoundries Inc., Grand Cayman, KY;
Charles L. Arvin, Hopewell Junction, NY (US);
Kenneth Bird, Hopewell Junction, NY (US);
Charles C. Goldsmith, Hopewell Junction, NY (US);
Sung K. Kang, Chappaqua, NY (US);
Minhua Lu, Yorktown Heights, NY (US);
Clare J. McCarthy, Hopewell Junction, NY (US);
Eric D. Perfecto, Hopewell Junction, NY (US);
Srinivasa S. N. Reddy, Lagrangeville, NY (US);
Krystyna W. Semkow, Hopewell Junction, NY (US);
Thomas A. Wassick, Hopewell Junction, NY (US);
GLOBALFOUNDRIES INC., Ugland House, KY;
Abstract
Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.