Charles C Goldsmith

Title: The Innovations of Charles C. Goldsmith

Introduction

Charles C. Goldsmith is a notable inventor based in Poughkeepsie, NY (US). He holds a total of 12 patents that reflect his significant contributions to the field of semiconductor technology. His work primarily focuses on improving the reliability and performance of solder interconnect structures.

Latest Patents

One of Goldsmith's latest patents is for electromigration-resistant lead-free solder interconnect structures. This invention includes a lead-free solder interconnect structure and methods for creating it. The structure features a semiconductor substrate with a last metal layer, a copper pedestal, a barrier layer, a barrier protection layer, and a lead-free solder layer that contacts the copper pedestal. Another significant patent addresses the stress locking layer for reliable metallization. This innovation allows recrystallization and grain growth of metals, such as copper, at higher anneal temperatures. By forming a metal stress locking layer on the copper before annealing, the invention suppresses atom diffusion, resulting in low tensile stress at room temperature after the anneal process.

Career Highlights

Goldsmith has had a distinguished career, working with prominent companies such as IBM and Globalfoundries Inc. His expertise in semiconductor technology has made him a valuable asset in these organizations.

Collaborations

Throughout his career, Goldsmith has collaborated with notable coworkers, including Eric D. Perfecto and Patrick William Dehaven. Their combined efforts have contributed to advancements in the field of semiconductor manufacturing.

Conclusion

Charles C. Goldsmith's innovative work in solder interconnect structures and metallization techniques has significantly impacted the semiconductor industry. His numerous patents and collaborations highlight his dedication to advancing technology and improving reliability in electronic components.