The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Jun. 28, 2005
Emanuel I. Cooper, Scarsdale, NY (US);
Charles C. Goldsmith, Poughkeepsie, NY (US);
Stephen Kilpatrick, Lagrangeville, NY (US);
Carmen M. Mojica, Dorado, PR (US);
Henry A. Nye, Iii, Brookfield, CT (US);
Emanuel I. Cooper, Scarsdale, NY (US);
Charles C. Goldsmith, Poughkeepsie, NY (US);
Stephen Kilpatrick, Lagrangeville, NY (US);
Carmen M. Mojica, Dorado, PR (US);
Henry A. Nye, III, Brookfield, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.