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For the Inventor, By the Inventor

Brookfield, CT, United States of America

Henry Atkinson Nye, Iii

USPTO Granted Patents = 22 

Average Co-Inventor Count = 4.9

ph-index = 11

Forward Citations = 450(Granted Patents)


Location History:

  • Danbury, CT (US) (1993)
  • Bedford, NY (US) (1996 - 1997)
  • Brookfield, CT (US) (1999 - 2011)

Company Filing History:

goldMedal22 out of 164,197 
 
International Business Machines Corporation
 patents
silverMedal1 out of 14,724 
 
Infineon Technologies Ag
 patents
where one patent can have more than one assignee

Years Active: 1993-2011

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22 patents (USPTO):Explore Patents
1. 8026613 - Interconnections for flip-chip using lead-free solders and having reaction barrier layers (2011-09-27),
2. 7923849 - Interconnections for flip-chip using lead-free solders and having reaction barrier layers (2011-04-12),
3. 7517736 - Structure and method of chemically formed anchored metallic vias (2009-04-14),
4. 7410833 - Interconnections for flip-chip using lead-free solders and having reaction barrier layers (2008-08-12),
5. 7276296 - Immersion plating and plated structures (2007-10-02),
6. 7273803 - Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure (2007-09-25),
7. 7037559 - Immersion plating and plated structures (2006-05-02),
8. 6946379 - Insulative cap for laser fusing (2005-09-20),
9. 6908841 - Support structures for wirebond regions of contact pads over low modulus materials (2005-06-21),
10. 6900142 - Inhibition of tin oxide formation in lead free interconnect formation (2005-05-31),
11. 6821890 - Method for improving adhesion to copper (2004-11-23),
12. 6784516 - Insulative cap for laser fusing (2004-08-31),
13. 6531759 - Alpha particle shield for integrated circuit (2003-03-11),
14. 6486557 - Hybrid dielectric structure for improving the stiffness of back end of the line structures (2002-11-26),
15. 6478212 - Bond pad structure and method for reduced downward force wirebonding (2002-11-12),

Title: Henry Atkinson Nye, III: Innovator in Microelectronics

Introduction

Henry Atkinson Nye, III is a notable inventor based in Brookfield, CT, USA. With a remarkable portfolio of 22 patents, Nye has made significant contributions to the field of microelectronics. His innovations focus on improving interconnection technologies, particularly in the realm of flip-chip applications.

Latest Patents

One of Henry's latest patents is titled "Interconnections for flip-chip using lead-free solders and having reaction barrier layers." This patent describes an advanced interconnection structure suitable for attaching microelectronic device chips to packages. It proposes a multi-layer ball-limiting composition that includes an adhesion/reaction barrier layer, enhancing the soldering process by allowing the solderable layer to be completely consumed while maintaining a barrier layer post-soldering. The invention also emphasizes the use of lead-free solder balls consisting primarily of tin, alongside various alloying components, making it a sustainable choice in electronics manufacturing.

Career Highlights

Henry has held key positions at prestigious companies such as IBM and Infineon Technologies AG. His work in these organizations has been instrumental in advancing microelectronic technologies, particularly in the development and implementation of innovative soldering techniques and materials.

Collaborations

Throughout his career, Henry has collaborated with esteemed professionals, including Stephen James Kilpatrick and Vincent James McGahay. These collaborations have enabled the cross-pollination of ideas and have been pivotal in driving forward-thinking solutions in the microelectronics space.

Conclusion

In conclusion, Henry Atkinson Nye, III stands out as a prolific inventor whose work in microelectronics continues to have a lasting impact on the industry. With an impressive portfolio of patents and a dedication to innovation, his contributions are sure to influence future technologies and practices in the field.

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