The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2007
Filed:
Dec. 01, 2003
Yu-ting Cheng, HsinChu, TW;
Stefanie Ruth Chiras, Peekskill, NY (US);
Donald W. Henderson, Ithaca, NY (US);
Sung-kwon Kang, Chappaqua, NY (US);
Stephen James Kilpatrick, Olney, MD (US);
Henry A. Nye, Iii, Brookfield, CT (US);
Carlos J. Sambucetti, Vallejo, CA (US);
Da-yuan Shih, Poughkeepsie, NY (US);
Yu-Ting Cheng, HsinChu, TW;
Stefanie Ruth Chiras, Peekskill, NY (US);
Donald W. Henderson, Ithaca, NY (US);
Sung-Kwon Kang, Chappaqua, NY (US);
Stephen James Kilpatrick, Olney, MD (US);
Henry A. Nye, III, Brookfield, CT (US);
Carlos J. Sambucetti, Vallejo, CA (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A ball-limiting metallurgy includes a substrate, a barrier layer formed over the substrate, an adhesion layer formed over the barrier layer, a first solderable layer formed over the adhesion layer, a diffusion barrier layer formed over the adhesion layer, and a second solderable layer formed over the diffusion barrier layer.