Ithaca, NY, United States of America

Donald W Henderson

USPTO Granted Patents = 26 


Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 212(Granted Patents)


Company Filing History:


Years Active: 1985-2014

where 'Filed Patents' based on already Granted Patents

26 patents (USPTO):

Title: Donald W Henderson: Innovator in Pb-free Solder Technologies

Introduction

Donald W Henderson, a prolific inventor based in Ithaca, NY, holds an impressive portfolio of 26 patents. His work primarily focuses on advancements in solder technologies, specifically in the development of additives that enhance the performance and reliability of Pb-free (lead-free) solder materials.

Latest Patents

One of Henderson’s latest patents involves "Additives for grain fragmentation in Pb-free Sn-based solder." This invention presents several groundbreaking methods where inert nano-sized particles, ranging from 1 nm to 1,000 nm, are incorporated into solder balls. These particles can include various compounds such as metal oxides, metal nitrides, metal carbides, and metal borides. Furthermore, Henderson also explores the addition of elemental metals that form stable high melting intermetallic compounds with tin, significantly contributing to the microstructural integrity of the solder.

Career Highlights

Throughout his career, Donald W Henderson has made significant strides in the field of materials science and engineering. He has worked with notable companies, including the International Business Machines Corporation (IBM), where he has played a vital role in advancing solder technologies that support various electronic applications. His contributions have been essential in driving innovations that adhere to contemporary standards of environmental safety and performance.

Collaborations

Henderson has collaborated with several esteemed colleagues, including Da-Yuan Shih and Sung Kwon Kang. Together, they have combined their expertise to innovate and refine solder materials, enhancing their applicability and functionality in the rapidly evolving electronics industry.

Conclusion

Donald W Henderson's extensive patent portfolio and collaborations underscore his significant contributions to the field of solder technology. His innovative approaches to using nano-sized particles in solder formulations not only improve product performance but also align with industry trends towards safer, Pb-free materials. As technology advances, Henderson's innovations will undoubtedly continue to play a key role in shaping the future of electronic manufacturing.

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