The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Nov. 16, 2004
Evan G. Colgan, Chestnut Ridge, NY (US);
Frank L. Pompeo, Redding, CT (US);
Glenn G. Daves, Fishkill, CT (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Bruce K. Furman, Poughquag, NY (US);
David L. Edwards, Poughkeepsie, NY (US);
Michael A. Gaynes, Vestal, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
Sung K. Kang, Chappaqua, NY (US);
Steven P. Ostrander, Poughkeepsie, NY (US);
Jaimal M. Williamson, Wappingers Falls, NY (US);
Da-yuan Shih, Poughkeepsie, NY (US);
Donald W. Henderson, Ithaca, NY (US);
Evan G. Colgan, Chestnut Ridge, NY (US);
Frank L. Pompeo, Redding, CT (US);
Glenn G. Daves, Fishkill, CT (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Bruce K. Furman, Poughquag, NY (US);
David L. Edwards, Poughkeepsie, NY (US);
Michael A. Gaynes, Vestal, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
Sung K. Kang, Chappaqua, NY (US);
Steven P. Ostrander, Poughkeepsie, NY (US);
Jaimal M. Williamson, Wappingers Falls, NY (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
Donald W. Henderson, Ithaca, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.